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Hot Melt Adhesive Tape Polyamide Kardel Hb-2 Card Hb-3 Hb-70-1 Card Packaging

Categories Hot Melt Adhesive Tape
Brand Name: Tunsing
Model Number: DS-5B
Certification: SGS , ISO9001
Place of Origin: China
MOQ: 100 Yards
Price: negotiable
Payment Terms: T/T , Western Union, PayPal, L/C
Supply Ability: 10000000 Yards / Month
Delivery Time: 5-8 work days
Packaging Details: 100yard/roll, 1-2roll/CTN
Keyword: Hot Melt Adhesive Tape
Color: Black
Width: 29mm
Thickness: 55±5μm
Length: 200m
Melting Point: 100-120℃
Melt Flow Index: 16±10g/10min ; Condition:ASTMD1238-04
Composition: Polyamide
Packing: 100yard/roll, 1-2roll/CTN
Application: Thermal packaging of IC card, SIM card, etc
Pressure: 0.25-0.4mpa
Dwell Time: 0.6S-1.2S
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Hot Melt Adhesive Tape Polyamide Kardel Hb-2 Card Hb-3 Hb-70-1 Card Packaging

Hot Melt Adhesive Tape Polyamide Kardel Hb-2 Card Hb-3 Hb-70-1 Card Packaging

Hot Melt Adhesive Tape Description:


This hot melt adhesive film is applied to the encapsulation of the contact smart card. It has excellent adhesion to PVC, ABS, PC, FR-4 materials. And aim at the damage to chip moudule due to high heat in the card-based laser bar code manufacture process , it can insulate the heat and avoide the thermal damage of module.

This product belongs to modified macromolecular structure type black hot melt adhesive tape. Superior cohesion ensures that there is no structural breakage in the thrust and bending tests after bonding. At the same time, it maintains a balanced bond strength with the chip and the card base.It meets the requirements of ISO7816 for chip encapsulation fastness.


Hot Melt Adhesive Tape Composition:

Polyamide synthesis modification

Hot Melt Adhesive Tape Physical Characteristics:

Color
Black
Release liner
Glassine release paper
Density
1.2±0.02g/cm³
Conventional Thickness
55μm
Melting point
100-120℃
Conventional Width
29mm
Melt Flow Index
16±10g/10min ; Condition:ASTMD1238-04
Conventional Length
200m
Finished Products Specification
55um*29MM*200M

Hot Melt Adhesive Tape Recommended Bonding Conditions:

First Lamination:
Second Implanting:
Machine Setting: 140℃-160℃
Machine Setting: 170℃-190℃
Dwell Time: 0.6S-1.2S
Dwell Time: 0.6S-1.2S
Pressure: 0.25-0.4mpa
Pressure: 0.25-0.4mpa

Hot Melt Adhesive Tape Applications:
DS-5B is suitable for thermal encapsulation of IC cards, SIM cards, financial social security cards, and dual interface bank cards.



Certification:




Packing & Delivery :

Packaging Details: 1PC / EAA FILM, 100yard/roll, 2~4roll/CTN, or it's up on the customer's option
Delivery Time: Shipped in 3-5 days after payment by air express.




FAQ :

1 .How about hot melt adhesive film?
A: It is just a film, and the basic material is release paper. But the film is solid in room temperature, when reach its melt point, it is able to bond other materials, Different materials of hot melt adhesive film have different performances and different usages, we need understand your demands ,then recommend you right products to you.

2.Do you accept OEM or ODM?
Yes ,we accept OEM and ODM, we are professional heat transfer material manufacturer ,having more than 10years experience. able to assist you R&D new products. So if you need bonding some special materials, please don’t hesitate to let us know.

3.How do you transport the products?
If you are not urgent, we usually transport by ship because it is the cheapest way. But for the West Asia area,
we deliver by train because there is no sea to ship. And for samples and urgent cargo, we transport it by air as it is the fastest way .Of course if you have other better idea about transport, we will accept it.

4. May I have your samples?
If you need some sample for reference, please let us know your fully address/ship
mode with courier ,and we will arrange sample for your reference.

5. How long is the lead time?
Sample lead time:3-7 days
Bulk lead time:7-10 days(depends on order quantity)

6. How do I pay for my order?
We accept L/C ,T/T ,Western Union , Paypal , Escrow



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