Categories | Multilayer PCB |
---|---|
Brand Name: | XCE |
Model Number: | XCEM |
Certification: | CE,ROHS, FCC,ISO9008,SGS,UL |
Place of Origin: | China |
MOQ: | 1pcs |
Price: | negotiation |
Payment Terms: | T/T,Western union |
Supply Ability: | 1, 000, 000 PCS / week |
Delivery Time: | 5-10 days |
Packaging Details: | inner: vacuum-packed bubble bag outer: carton box |
Size: | 9*9cm |
Surface finish: | Immersion gold |
Board thickness: | 1.6mm |
Material: | Rogers |
High Technical Multilayer PCB Boards With Prototype Design Service
Specification:
Model | XCEM | Origin | Shenzhen,China |
Min line space | 3mil | Min line width | 3mil |
Size | 9*9cm | Copper foil | 35UM |
Layer | 6 | Material | Rogers |
Parameter:
Layer | 6 |
Material type | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
Board thickness | 0.21mm to 7.0mm |
Copper thickness | 0.5 OZ to 6 oz |
Size | Max. Board Size: 580mm×1100mm |
Min. Drilled Hole Size: 0.2 mm (8 mil) | |
Min. Line Width: 4mil (0.1mm) | |
Min. Line Spacing: 4mil (0.1mm) | |
Surface finishing | HASL / HASL lead free, HAL, Chemical tin, Immersion Silver/Gold, OSP, Gold plating |
Solder Mask Color | Green/Yellow/Black/White/Red/Blue |
Tolerance | Shape tolerance: ±0.13 |
Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |
Certificate | UL, ISO 9001, ISO 14001 |
Special requirements | Buried and blind vias+controlled impedance +BGA |
Profiling | Punching, Routing, V-CUT, Beveling |
Our Quality:
We are committed to providing the HIGHEST QUALITY PCBs that not only meet but exceed our customers’ expectations and requirements. Our facilities hold a list of quality certifications (IS9001, TS16949, UL) and the systems to support them. For quality control purposes, we have invested extensively in inspection machinery, including:
High-voltage E-test
Flying probe machine
Digital computer metallographic microscope
Copper thickness tester
Solderability detecting machine
Photoelectricity balance
X-ray gold thickness tester
Backlighting tester
Automatic optical inspector